1
C
HAPTER
1
Specifications
The ultra-compact and highly integrated VIA EPIA-EX uses the
Mini-ITX mainboard form-factor developed by VIA Technologies,
Inc. as part of the company’s open industry-wide total
connectivity initiative. The mainboard enables the creation of an
exciting new generation of small, ergonomic, innovative and
affordable embedded systems. Through a high level of
integration, the Mini-ITX occupy 66% of the size of FlexATX
mainboard form factor.
Comments to this Manuals